Micha W.'s abstract v0.1

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+\documentclass{scdpg}
+\begin{document}
+\scBookLanguage{de}
+\begin{scAbstract}
+\scLanguage{en}
+\scTitle{the next generation CBM MVD front-end electronics and their capabilities}
+\scAuthor{*}{Michael}{Wiebusch}{1}
+\scAuthor{}{Jan}{Michel}{1}
+\scAuthor{}{Joachim}{Stroth}{1}
+\scAffiliation{1}{Goethe-Universit\"at, Frankfurt}
+\scCollaborationName{CBM}
+\scBeginText
+Due to the combination of high spacial resolution and low material budget, monolithic active pixel
+sensors (MAPS) are suited to be employed in the future CBM Micro Vertex Detector. The final sensor
+is not yet available so mechanical integration and readout concepts are being developed around
+MIMOSA26 which is the most similar chip available.
+
+A test beamtime in November 2012 proved that the current FGPA based readout chain is functional. However
+it also revealed its weaknesses. Meanwhile the readout concept was changed to make use of a
+different, more capable FPGA platform and a next generation of front-end electronics was designed and produced.
+The new front-end electronics are aimed to compensate for their predecessors' insufficiencies and
+feature a set of additional configuration and monitoring capabilities.
+
+This contribution will present the next generation front-end electronics design and evaluate it
+against first measurement results taken with the front-end electronics connected to the sensor.
+
+*This work is supported by BMBF (06FY9100I and 06FY7114), HIC for FAIR, EMMI, GSI and HGS-Hire.
+
+
+\scEndText
+\scConference{Frankfurt 2014}
+\scPart{HK}
+\scContributionType{Vortrag;Talk}
+\scTopic{Instrumentierung}
+\scEmail{mwiebusch@stud.uni-frankfurt.de}
+\scCountry{Germany}
+\end{scAbstract}
+\end{document}