some possible changes to MVD FEB abstract

diff --git a/DPG14/MVD_front-end_dpg_14.tex b/DPG14/MVD_front-end_dpg_14.tex
index 3e08ca32833c70e521f0b5db52ae6c818851830a..53279d78e6fc01a167d11ca3104ad6eed22f1c4b 100644 (file)
--- a/DPG14/MVD_front-end_dpg_14.tex
+++ b/DPG14/MVD_front-end_dpg_14.tex
@@ -3,28 +3,32 @@
 \scBookLanguage{de}
 \begin{scAbstract}
 \scLanguage{en}
-\scTitle{the next generation CBM MVD front-end electronics and their capabilities}
+\scTitle{The Next Generation of CBM MVD Front-end Electronics and Their Capabilities}
 \scAuthor{*}{Michael}{Wiebusch}{1}
 \scAuthor{}{Jan}{Michel}{1}
 \scAuthor{}{Joachim}{Stroth}{1}
 \scAffiliation{1}{Goethe-Universit\"at, Frankfurt}
 \scCollaborationName{CBM}
 \scBeginText
-Due to the combination of high spacial resolution and low material budget, monolithic active pixel
-sensors (MAPS) are suited to be employed in the future CBM Micro Vertex Detector. The final sensor
-is not yet available so mechanical integration and readout concepts are being developed around
-MIMOSA26 which is the most similar chip available.
+The Micro Vertex Detector (MVD) for the CBM experiment is a highly granular 
+precision tracking device.
+Due to the combination of high spacial resolution, low material budget and radiation 
+hardness, monolithic active pixel sensors (MAPS) are the most suited detector 
+technology for this purpose. A full read-out chain for these sensors was designed 
+and a test experiment in November 2012 proved that the current readout 
+chain is functional. However it also revealed some weaknesses of the scheme, so that 
+a new revision of electronics was envisaged. In this scope, the system moved to a 
+more capable FPGA platform and a next generation of front-end electronics was 
+designed and produced. Among others, the new design features a set of additional 
+configuration and monitoring capabilities which will be used to investigate the best 
+scheme for supplying power and critical analog signals to the sensor. The main 
+challenge is the distance between active electronics and the actual sensor which is 
+constrained by radiation levels and the in-vacuum operation of the detectors.
 
-A test beamtime in November 2012 proved that the current FGPA based readout chain is functional. However
-it also revealed its weaknesses. Meanwhile the readout concept was changed to make use of a
-different, more capable FPGA platform and a next generation of front-end electronics was designed and produced.
-The new front-end electronics are aimed to compensate for their predecessors' insufficiencies and
-feature a set of additional configuration and monitoring capabilities.
+This contribution will present the current front-end electronics design and evaluate 
+it against the older concept including first measurement results.
 
-This contribution will present the next generation front-end electronics design and evaluate it
-against first measurement results taken with the front-end electronics connected to the sensor.
-
-*This work is supported by BMBF (06FY9100I and 06FY7114), HIC for FAIR, EMMI, GSI and HGS-Hire.
+*This work is supported by BMBF (06FY9100I and 06FY7114), HIC for FAIR, EMMI, GSI.
 
 
 \scEndText