Especially in the outer stations, substantial parts of those cables are placed inside the acceptance and hence contribute to multiple scattering.
Those cables are flexible printed circuits (FPC) and provide power to the CMOS Pixel Sensors (CPS), allow to control them, and to read out the hits.
%The connections to the MAPS sensors will be made with wire-bonding while the FEE-facing side is plugged into a ZIF-connector.
-The previous-generation cable was not specifically optimized for ultra-low material budget, being a two-layer copper-based cable with a layer thickness of about $25~\mathrm{\mu m}$.
+The previous-generation cable was not specifically optimized for ultra-low material budget, being a copper-based cable with a layer thickness of about $25~\mathrm{\mu m}$.
It was successfully tested in a beamtime with the CBM-MVD prototype~\cite{Koziel}.