From: Jan Michel Date: Wed, 17 Jul 2013 16:45:25 +0000 (+0200) Subject: few more details X-Git-Url: https://jspc29.x-matter.uni-frankfurt.de/git/?a=commitdiff_plain;h=e42193acdf09c4b2ac4001a6051da46ddbd224d9;p=mvd_docu.git few more details --- diff --git a/electronics/electronics2013.tex b/electronics/electronics2013.tex index 528c3b1..995a30d 100644 --- a/electronics/electronics2013.tex +++ b/electronics/electronics2013.tex @@ -44,6 +44,10 @@ If there is a special AddOn later on, it could have these features: } \section{Cable TRB to CB} +The 40-pair twisted pair flat cable used for TDC applications at GSI provides all connectivity for +one converter board. The cables can be made in any length, so we can do studies about the maximum +length. \final{The final setup will most likely use different cables with better shielding and +improved handling.} Cables as well as connectors will be bought by GSI. \begin{table}[htp] \centering @@ -84,20 +88,26 @@ amplification of 50 - 100. In total, 7 single ended plus 4 differential ADC chan sensor. The on-board ADC should provide at least 1 MSPS and a SPI (or similar) interface. AD7928 is a -possible candidate. If necessary, an external monitoring board can be connected for testing -purposes. Such a TRB3-AddOn is currently in preparation at GSI (52 channels, 12 Bit, 40 MSPS). +possible candidate for single ended measurement. It can also provide the differential measurements +if a pre-amplification stage with OpAmps is included if a dedicated ADC is not available. +If necessary, an external monitoring board or oscilloscope can be connected for testing purposes. +Such a TRB3-AddOn is currently in preparation at GSI (52 channels, 12 Bit, 40 MSPS). Current sensing can be implemented with dedicated current monitors, e.g. TSC101 to reduce count of components. \subsection{Board Control} All voltages are switchable from FPGA. The JTAG chain needs the option to disable individual -sensors. Both features can make use of a 74HC259 IC to reduce number of lines. +sensors. Both features can make use of a 74HC259 IC to reduce number of lines. This chip also +provides the CE signals for ADCs if needed. \subsection{Connectivity} -All communication to the TRB3 should be differential, despite on some static signals. Test pads for -most signals should be added to connect external, more precise instruments. +All communication to the TRB3 should be differential, maybe despite on some static signals. Test +pads for most signals should be added to connect external, more precise instruments. + +All signals from and to the sensor should be fed through LVDS buffers to reduce the load on the +sensors' output drivers and to improve signal quality. \subsection{Test Features}