From c8db8afc52fb118b3ee0215fce6482b55edb9a36 Mon Sep 17 00:00:00 2001 From: Jan Michel Date: Wed, 27 Nov 2013 14:23:41 +0100 Subject: [PATCH] some possible changes to MVD FEB abstract --- DPG14/MVD_front-end_dpg_14.tex | 32 ++++++++++++++++++-------------- 1 file changed, 18 insertions(+), 14 deletions(-) diff --git a/DPG14/MVD_front-end_dpg_14.tex b/DPG14/MVD_front-end_dpg_14.tex index 3e08ca3..53279d7 100644 --- a/DPG14/MVD_front-end_dpg_14.tex +++ b/DPG14/MVD_front-end_dpg_14.tex @@ -3,28 +3,32 @@ \scBookLanguage{de} \begin{scAbstract} \scLanguage{en} -\scTitle{the next generation CBM MVD front-end electronics and their capabilities} +\scTitle{The Next Generation of CBM MVD Front-end Electronics and Their Capabilities} \scAuthor{*}{Michael}{Wiebusch}{1} \scAuthor{}{Jan}{Michel}{1} \scAuthor{}{Joachim}{Stroth}{1} \scAffiliation{1}{Goethe-Universit\"at, Frankfurt} \scCollaborationName{CBM} \scBeginText -Due to the combination of high spacial resolution and low material budget, monolithic active pixel -sensors (MAPS) are suited to be employed in the future CBM Micro Vertex Detector. The final sensor -is not yet available so mechanical integration and readout concepts are being developed around -MIMOSA26 which is the most similar chip available. +The Micro Vertex Detector (MVD) for the CBM experiment is a highly granular +precision tracking device. +Due to the combination of high spacial resolution, low material budget and radiation +hardness, monolithic active pixel sensors (MAPS) are the most suited detector +technology for this purpose. A full read-out chain for these sensors was designed +and a test experiment in November 2012 proved that the current readout +chain is functional. However it also revealed some weaknesses of the scheme, so that +a new revision of electronics was envisaged. In this scope, the system moved to a +more capable FPGA platform and a next generation of front-end electronics was +designed and produced. Among others, the new design features a set of additional +configuration and monitoring capabilities which will be used to investigate the best +scheme for supplying power and critical analog signals to the sensor. The main +challenge is the distance between active electronics and the actual sensor which is +constrained by radiation levels and the in-vacuum operation of the detectors. -A test beamtime in November 2012 proved that the current FGPA based readout chain is functional. However -it also revealed its weaknesses. Meanwhile the readout concept was changed to make use of a -different, more capable FPGA platform and a next generation of front-end electronics was designed and produced. -The new front-end electronics are aimed to compensate for their predecessors' insufficiencies and -feature a set of additional configuration and monitoring capabilities. +This contribution will present the current front-end electronics design and evaluate +it against the older concept including first measurement results. -This contribution will present the next generation front-end electronics design and evaluate it -against first measurement results taken with the front-end electronics connected to the sensor. - -*This work is supported by BMBF (06FY9100I and 06FY7114), HIC for FAIR, EMMI, GSI and HGS-Hire. +*This work is supported by BMBF (06FY9100I and 06FY7114), HIC for FAIR, EMMI, GSI. \scEndText -- 2.43.0